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Eltete TPM Engineering innovations and new technology get warm welcome at SuperCorrExpo and Pack Expo
16.12.2008

Eltete TPM Engineering innovations and new technology get warm welcome at SuperCorrExpo and Pack Expo

Eltete TPM Engineering exhibited at SuperCorrExpo in Atlanta and CPP Expo (Pack Expo) in Chicago raising great interest with its technology and innovations. The company was said to be one of the few that had managed to create something new within the industry.

Visitors of both expos were impressed by the ingenuity of Eltete TPM machine lines. Generally, Eltete TPM Engineering was remarked for the technology that is unique and that clearly has its roots firmly in environmental thinking which crystallizes in the company slogan: 3R – Reduce, Replace and Recycle. Also, Eltete’s concept of offering both transport packaging materials and the machines to manufacture them, gained astonishment.

All and all, Eltete TPM Engineering regards SuperCorrExpo and Pack Expo fairs a great success. The attention the company gained at these expos proves that steps were taken in the right direction. It is certain that the hard work the company has done in developing the technology will pay off as new business opportunities in the near future.

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Eltete Ltd. P.O. Box 94, 07901 Loviisa, FINLAND email: info(at)eltete.com Tel. +358 (0)19 510 31 Fax +358 (0)19 510 3200